Wire Polishing Machine - WPAB1S
This machine is designed and developed for sizing and polishing of polycrystalline, natural and Mono diamond dies of size range from 0.100mm to 10.00mm. The machine is specially designed for the RBD sizes of range 2.500 mm to 10.00 mm.

The Machine is manufactured with precision engineering and especially consists of self centering oscillating type die holder and reciprocating wire clamping device. Die rotation and stroke speeds are continuously variable. Individual controls are provided for die rotation, stroke and oscillation. All operations are controlled by electronic timer with digital display especially spindle and stroke motors are operating through Japanese make AC drives. To speed up the working of RBD dies, a special feature to exert side pressure on the die is provided.

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